New Pall membrane filter for semiconductor fabrication

A next-generation, highly asymmetric membrane technology for semiconductor fabrication that advances wet chemical filtration performance to a level of 10 nanometers and reduces energy costs was announced on 7 July 2010 by Pall Corporation.

The new Pall Ultipleat® SP DR series filter cartridge will be unveiled at SEMICON West 2010, the annual event for the global microelectronics industry, in San Francisco during 13-15 July 2010.

“Pall’s new Ultipleat SP DR series filter reduces defects and improves productivity by increasing filtration efficiency in Front End of Line (FEOL) wet chemical surface preparation processes,” said Jon Weiner, president, Pall Microelectronics. “This includes critical pre-clean stages where removal of a ‘killer defect’ particle size down to 10 nanometers is required.”

Surface preparation entails wet chemical cleaning to remove contamination at numerous stages of the semiconductor device fabrication process. The ultra-clean Ultipleat SP DR membrane material is compatible with typical surface preparation and cleaning chemistries to 70°C.

The filter’s patented membrane technology boosts filtration performance nearly 50% over current filter designs. It uses an advanced non-fluoropolymer material that provides a chemically resistant and more hydrophilic alternative to all-fluoropolymer filters. The proprietary graded pore structure achieves 10 nm retention while the high fluid permeability reduces the load on pumps, thereby lowering energy costs.